PhoQS-Projekt: Modellierung und Optimierung photonischer Wirebonds
Overview
High-quality photonic interconnects enable technological advances, both in optical data transmission and in quantum research projects. In this research project, optical broadband coupling methods will be investigated. A nano-precise 3D printer can be used to fabricate structures for photonic interfaces. Important work packages of this project include the simulative investigation, optimization, and measurement of different coupling architectures. To be investigated are fiber-to-chip (end-facet or grating couplers) or chip-to-chip photonic interfacing (end-facet, grating couplers or other coupling types). Material platform-dependent recipes of the diverse coupling strategies will be developed.
Key Facts
- Project duration:
- 09/2023 - 12/2024